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Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

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Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

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Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

Brand Name : HT

Model Number : HT-CT

Certification : ISO9001:2015

Place of Origin : China

MOQ : 1

Price : price negotiable

Payment Terms : T/T

Supply Ability : 300/pcs per month

Delivery Time : 2-3weeks

Packaging Details : Carton Box

using : Back grinding machines, dicing saws

flatness : high

parallelism : depth

dress : easy to dress

size : 2, 3, 4, 5, 6, 8 and 12 inch

Feature : Durable

planarity : 0.005

fit for : Strasbaugh

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Wafer Back table for silicon Grinding Machines Porous Chuck Table High planarity 12 Inch fit for Strasbaugh

Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent cost effectiveness.

Features:

1	This wafer chuck provides a high flatness and depth of parallelism.
2	It is compact in structure, uniform size and high strength.
3	It features a well-distributed absorption capacity.
4	The dicing accessory is easy to dress.

Applications

2, 3, 4, 5, 6, 8 and 12 inch semiconductor wafers back grinding

Applicable Machines

Back grinding machines, dicing saws

Type

Ceramic,Metal

Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency

Product Tags:

vacuum chuck table

porous ceramic vacuum chuck

Silicon Grinding Machines Wafer Chuck Back Grinding With High Efficiency Images

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