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Brand Name : Hongtuo
Model Number : HT-BGW
Certification : ISO9001:2015
Place of Origin : China (Mainland)
MOQ : 2
Price : Price can be negotiated
Payment Terms : T/C,T/T
Supply Ability : 300/pcs per month
Delivery Time : 2-3weeks
Packaging Details : Carton Box
Name : Silicon wafer back Grinding Wheels
Applications : Ceramich ships, Al3O2, Semiconduction
Space code : 6A2 or 6A2H;6A2T
Finishing : Nitride
Body : LED substrate
Structure : With flange or without
Back Grinding Wheel with LED substrate Silicon Wafer Back Grinding Wheels
Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.
LED Substrate Back Grinding Wheels
This variety of cup grinding wheel is mainly used in the LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.
Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers
Application: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Workpiece material: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials.
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LED Substrate Silicon Wafer Back Grinding Wheels With Flange Or Without Images |